Semiconductor Packaging Equipment/led/high Precision Die Bonder/die Bonding Machine / Die Attach Die BonderDie Bonder
Suitable for: SMD HIGH-POWER COB,part COM in-line package etc.
1,Full automatic up load and down load materials.
2,Module design,max optimization structure.
3,Full intellectual property right.
4,Picking die and Bonding die dual PR system.
5,Multi-wafer ring,dual glue ect configuration.
Wafer Stage System
The wafer table assembly consists of an X/Y moving platform and a T rotating part. Linear servo controls the movement of the X/Y
platform so that the center of the wafer is consistent with the center of the image. The motor of X/Y platform is equipped with
servo driver, HIWIN guide rail and high-precision grating ruler. T rotation can control the wafer to the desired angle.
Feeding and Receiving System
The Z-axis of the receiving system uses a stepper motor+screw to control the lifting and lowering of the material box and the
precise control of the position of each layer. The length and width of the material box can be manually adjusted and locked
according to actual needs, and the left and right material boxes can be quickly switched.
Imaging system
The image system consists of an X/Y/Z three-axis manual precision adjustment platform, a Hikvision high-definition lens barrel
and a 130w high-speed camera. The X/Y adjustment platform controls the center of the camera and the center of the base island, and
the Z-axis adjustment platform controls the focal length adjustment.
| Product name | die bonding machine |
| Solid crystal cycle | >40 ms |
| Die bonding position accuracy | ±0.3 mil |
| Dispensing heating | constant temperature |
| Resolution | 0.5 um |
| Chip ring size | 6 inch |
| Image identification | 256 gray scale |
| Fetching pressure | 20-200 g |
| Frequency | 50 HZ |
| Dimension(L*W*H) | 1545*1080*1715 mm |
| Weight | 1040 |
| Voltage | 220 V |
| Power | 1.3 KW |
Swing arm system
The pick-and -place system of the welding head is composed of the Z axis and the rotating axis, which controls the rotation of the
swing arm and the movement of the Z axis to complete the picking and releasing of the wafer from the wafer to the frame. Rotation
and Z-axis movement are composed of Yaskawa servo motor and precision mechanical structure to provide higher precision and
stability.
Operating system
It adopts Windows 7 system and Chinese operation interface, which has the characteristics of simple operation and smooth
operation, which is in line with the operation habits of Chinese people.
